Rework services


  •  Component Replacement
  •  Custom Modifications
  •  Dense Connector Replacement
  •  Over night services by request

Manufacturing CAPABILITIES


Our Capabilities Include


  •  Conventional through hole  component technology
  • Surface mount technology bullet BGA (Ball Grid Array)
  • Flex Circuits
  • X-ray and Microscope Inspection
  • Consignment or turnkey
  • 24 hour, quick turn about assemblies
  • Prototype to medium volume production
  • Conformal coating 
  • Printed Circuit Board (PCB) Services
  • Chassis & Product Assembly
  • Cable & Harness Assembly 
  • Final Packaging .


SERVICES

 

We offer the following services:


  •  Circuit Design and Development
  •  Component Engineering Support
  •  Process Control that assures High Quality and repeatability
  •  DFTM
  • Through Hole Assembly
  •  Surface Mount Assembly
  •  Prototype Assembly
  •  Board Rework
  • Lead Free Assemblies